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Press Releases
New TCA 1 of Copper Bonding Wire Developed and Launched Singapore, 16 July 2008 -- TOKYO, July 16 /Xinhua-PRNewswire/ -- Tanaka Denshi Kogyo K.K. (Tokyo), the top manufacturer of bonding wires, will substantially expand the production of copper bonding wires with excellent electrical conductivity and mechanical properties at bonding, all at a much lower price, to meet increasing demand as a substitute for gold bonding wire, prices of which have been rising with the prices of gold bullion. It will also more vigorously promote sales for Taiwan and Singapore. In order to achieve it, the company establishes new production lines in Singapore and in Saga in Japan, increasing 5 times as much the amount of monthly productions as what it is.. Tanaka Denshi Kogyo has also developed its new copper bonding wire, TCA 1, with equivalent performance to the gold bonding wire, and proactively tries to expand its share in the copper bonding wire market. Replacement with TCA 1 copper bonding wire allows material costs to be cut by two-thirds. The new TCA 1 is copper bonding wire of 99.99% purity, available in diameters ranging from Phi 20 micrometer -- Phi 70 micrometer. Using the company’s own processing technology, the characteristics of predecessors copper bonding wires were improved, yielding excellent mechanical properties (stable first bonding), electrical conductivity and surface characteristics. The company has developed and produced multiple types of bonding wires, including gold, aluminum and copper, for various uses. Market shares in the world for gold and aluminum bonding wires are the highest, and copper bonding wire ranks second. Media Contacts: Hiroshi Sato Tanaka Kikinzoku International K.K. Tel: +81-3-5222-1315 Submitted by Xinhua PR Newswire, Xinhua PR Newswire on Wednesday, 16 July 2008 at 12:04 PM Category: Enterprise Technology |
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